Earlier this month we learned of the HTC Ville when the specs were leaked and today we get out first look at the device thanks to some renders shared by Evan Blass of PocketNow. As previously reported, the HTC Ville is rumored to feature a metal unibody design under 8mm thick, which would make it HTC’s thinnest handset to date.
In addition to being the thinnest Android phone from HTC, it should also be the fastest. The Ville is rumored to be one of the first devices with Qualcomm’s new Snapdragon S4 processor. The dual-core Snapdragon S4 will feature Qualcomm’s new Krait core that offers a 60% performance increase compared to the existing Scorpion micro-architecture found in the Snapdragon S1, S2, and S3. A new Adreno 225 GPU will also provide 50% faster graphics performance.
Rumored specs of the HTC Ville include:
- Android 4.0 Ice Cream Sandwich
- HTC Sense UI 4.0
- 4.3-inch qHD Super AMOLED display
- 1.5GHz dual-core Snapdragon S4 (MSM8960)
- 8-megapixel backside-illuminated camera with 1080p HD video capture
- Beats Audio
- Metal construction case and just 8mm thick
- 1650 mAh battery
- No NFC support
Expect HTC to debut the Ville at Mobile World Congress in late February. If the rumored release date holds true, we should see the HTC Ville in stores by April. Possible carriers in the US include AT&T and Verizon (and maybe Sprint?), since the Snapdragon S4 will be the first system-on-a-chip to feature an integrated multimode LTE modem.
If you’ve been waiting on the second-generation of 4G LTE phones that are thinner and offer longer battery life, then pencil in the HTC Ville at the top of your wish list.